Package design and realization of a microwave photon detector component

In order to realize the high integration and the high reliability of the microwave photon system, a package design and realization of the microwave photon detector assembly was implemented. The idea of the customized package design was introduced, the kovar alloy was selected as the shell material, the oblique lens fiber was adapted in the horizontal placement scheme, and the package process as well as the key process points were given.

The photocoupling efficiency of the final package assembly ranges from 68% to 79%, which meets the requirements of the overall index. This detector assembly realizes the array integration and the hermetic package of microwave chip and the photon chip in the same package, by means of the hybrid integrated package method. The package design and the realization method of the assembly can be applied to other microwave photonic products, which contribute to improve the integration and the reliability of radio frequency transmission system.