Structure design of LED in surface mount package

In order to improve the packaging-structure efficiency of the surface mount package (SMP) light emitting diode (LED) packaging-structure, the simplified model of SMP LED packaging-structure was established as well as realized the continuous automatic generation, simulation and optimization of LED packaging-structure. The results show that under the same color temperature condition, there is a linear relationship between the luminous flux and the radiation flux, and the change of the side wall can cause the light flux first increased and then decreased. Beside, by testing three kinds of LEDs with different side wall angles, the trends of the luminous flux are identical both in the simulation results and the test results, and it is concluded that the optimal side wall angle is 60° for this type of packaging, which verify the correctness of the simulation.