单晶热释电探测器混合集成制造方法研究

金娜; 刘卫国

单晶热释电探测器混合集成制造方法研究

金娜^,,
刘卫国

1.
西安工业大学光电微系统研究所,陕西西安710032

详细信息

通讯作者:
金娜(1964-)，女，四川成都人，副教授，主要从事光电传感器制造与应用的研究工作。

中图分类号: TN215
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出版历程
- 刊出日期: 2010-03-12

Novel hybrid integration approach for fabrication of single crystal pyroelectric detector

JIN Na^,,
LIU Wei-guo

1.
Micro-optoelectronic Systems Labs,Xi’an Technological University,Xi’an 710032,China

摘要

摘要: 在比较几种探测器集成制造方法的基础上，提出采用各向异性导电膜作为电信号互联的手段，实现热释电探测器与信号处理电路的混合集成，从而演示了一种兼容性良好的集成化多传感器制造方法。对单晶钽酸锂热释电探测器采取机械研磨减薄获得其薄膜，利用3M的5552R各向异性导电膜，实现了探测器与信号读出电路的互联。对探测器的测试表明：机械研磨减薄获得的钽酸锂薄膜表现出与晶体接近的热释电特性，探测器表现出良好的绝热性质和动态响应特性。
- 各向异性导电膜 /
- 多传感器 /
- 混合集成 /
- 热释电探测器
Abstract: Several possible methods for the fabrication of integrated sensors were compared and a novel hybrid integration method was developed. To realize the hybrid integration of the pyroelectric detector with the signal readout circuit (ROIC), it is proposed to use the anisotropic conductive tape as the interconnection between the sensor and the ROIC. The method showed good compatibility for the fabrication of integrated multi-sensors. Single crystal LiTaO3 (LT) was used as the pyroelectric material for demonstration purpose. The LT wafer was thinned with mechanical grinding method. 3M z-axis adhesive film 5552R was used as the anisotropic conductive film to realize the interconnection between the sensor and the ROIC. Results showed that the LT thin film had similar pyroelectric properties as those of the single crystal wafer. The integrated pyroelectric detector showed good thermal isolation characteristics and high dynamic response.
- anisotropic conductive tape /
- multi-sensor /
- hybrid integration /
- pyroelectric detector

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参考文献(1)

［1］KROGER T,FINKEMEYER B,WINKELBACH S,et al. Demonstration of multi-sensor integration in industrial manipulation［C］∥ Proc 2006 IEEE International Conference on Robotics and Automation. Orlando, Florida:［s.n.］, 2006:4282-4284.
［2］MILGREW M J, CUMMING D R S, HAMMOND P A. The fabrication of scalable multi-sensor arrays using standard CMOS technology［C］∥ Proc IEEE Conf Custom Integrated Circuits (CICC). San Jose, California:［s.n.］. 2003:513-516.
［3］SCRIBNER D A, KRUER M R, KILLIANY J M. Infrared focal plane array technology［J］.IEEE,1991,79(1):66-85.
［4］刘军汉,刘卫国.超薄LiTaO3晶片的键合减薄技术［J］.应用光学,2007, 28(6):769-772.
LIU Jun-han, LIU Wei-guo. Ultrathin LiTaO3 wafer prepared by wafer bonding and mechanical thinning processes［J］. Journal of Applied Optics,2007,28(6):769-772. (in Chinese with an English abstract)
［5］3M Company.Z-axis adhesive film 5552R［R］. Min-nesota, USA: 3M Company, 2000.

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