Abstract: Because of the traditional inspection system not being able to detect the defects at solder joints and solder bridges in ball grid array (BGA ) as well as the emergence of miniaturized packaging, high-density assembly and various new packaging technologies, a high resolution inspection system is proposed to solve this problem. A new type of high-resolution X-ray image intensifier is introduced. As one of the key devices for circuit board testing and chip packaging detection, its resolution performance has become a bottleneck for the development of X-ray detection system. Its resolution reached 20lp/mm after the improvement of the fabrication process and the use of new window material for vacuum sealing.