Abstract: This paper reviews characteristics and performance of a 160×120 uncooled infrared focal plane array made from amorphous silicon microbolometers with a pixel-pitch of 25μm, integrated in a LCC package compatible with mass production. The 25μm pixel architecture profits from the low thermal time constant which characterizes our technology, to design a higher pixel thermal insulation and therefore to develop a 25μm version from the well mastered 35μm technology. Thanks to a new pixel design and by pushing the design rules even further, a high fill factor has been kept, without the use of complex, as well as expensive, two-level structure. The detector is described in terms of ROIC architecture, packaging, operability and electro-optical performances. A new read out integrated circuit structure has been designed for this detector. High level functions like gain, image flip and integration time could be operated through a serial link to minimize the number of electrical interconnections. A small LCC package has been developed enabling a mass production of detectors for compact hand held or helmet mounted cameras.