Abstract: To overcome the shortcomings of thickfilm capacitors (limited size, low capacity and high dissipation) fabricated by traditional thickfilm technology, which limit their applications to some specific areas, a technology fabricating the thickfilm capacitors on ceramic substrate by laser microcladding rapid prototype is put forward. The novel technology does not take the mask as a necessity as in the former capacitor. The structure and properties of the capacitor fabricated by laser microcladding and the traditional sintering method, which includes capacity, dielectric crystal, quality factor and insulation resistance, are analyzed. The forming mechanism of the capacitor is studied. The results prove that, compared with those made with traditional sintering techniques, the capacitors fabricated by laser microcladding rapid prototype method have better repeatability and higher capacity, it is more compact and also minimizes the composition diffuseness between interfaces.