LiNbO3芯片的无损边缘抛光实验

李攀; 白满社; 邢云云; 严吉中

LiNbO3芯片的无损边缘抛光实验

西安飞行自动控制研究所,陕西西安 710065

基金项目:

总装十二五规划资助项目（51318020101）

详细信息

通讯作者:
李攀（1983-），男，陕西西安人，工程师，主要从事超光滑表面加工方向的研究。 Email：lp_forever5281@sina.com

中图分类号: TN305.2
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- 文章访问数: 1454
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出版历程
- 刊出日期: 2014-11-14

Experiment on defect-free edge polishing of LiNbO3 chips

AVIC Xi-an Flight Automatic Control Research Institute, Xi-an 710065,China

摘要

摘要: 以抛光垫抛光工艺为基础，研究出一套完整的新型无损边缘抛光工艺，成功实现了高精度光纤陀螺集成光学调制器LiNbO3芯片边缘的无损抛光。即在分析LiNbO3芯片边缘抛光过程中棱边损伤产生原因的基础上，提出3条解决措施：控制研抛浆料中的大颗粒；选择低亚表面损伤的抛光方式；抛光颗粒的大小接近或小于临界切削深度的2倍。加工工件棱边在1 500显微镜下观察无可见缺陷，芯片端面的表面粗糙度Ra0.8 nm，表面平面度优于/2，满足了LiNbO3芯片无损边缘抛光要求。同时，该工艺方法具有较大的推广应用价值。
- 铌酸锂 /
- 集成光学器件 /
- 边缘抛光 /
- 光纤陀螺
Abstract: To meet the requirements for defect-free edge polishing of high-precision fiber optic gyroscope integrated optic modulator LiNbO3 chips, a new polishing process based on pad polishing was developed. According to the analysis on the causes for edge damage during the edge polishing, three solutions were presented:controlling the big particles in polishing material, choosing the low sub-face damage polishing and making the particles size close to or less than double of the critical cutting depth. With the new process, the defect-free edge polishing of LiNbO3 chips could be achieved and the results show that the edges under 1 500 microscope have no visible defect, the chip end face roughness Ra is less than 0.8 nm and the surface flatness reaches better than /2.Additional,this polishing process has great application value.
- lithium niobate /
- integrated optics components /
- edge polishing /
- fiber optic gyroscope

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参考文献(1)

[1]Lefevre H C. The fiber optic gyroscope [M]. Norwood: Artech House, 1993：1-4.
[2]Weng Ju, Tian Chijun. IFOG progress toward high precision [J]. Journal of Chinese Inertial Technology, 2005, 13(5): 92-96.
翁炬, 田赤军. 向高精度发展的干涉型光纤陀螺仪技术[J]. 中国惯性技术学报, 2005, 13(5): 92-96.
[3]Liu Jieyu, Yang Jianye, Wang Lixin, et al. Error autocompensation of FOG-based rotating inertial measurement unit for ballistic missile [J]. Opto-Electronic Engineering, 2012, 39(6): 41-46.
刘洁瑜, 杨建业, 汪立新, 等. 弹载光纤陀螺旋转惯组误差自补偿技术[J]. 光电工程, 2012, 39(6): 41-46.
[4]Lei Feilin, Liu Jianwei, Wu Yujing, et al. Application of Kalman filter based fiber optic gyroscope in airborne electro-optical system [J]. Journal of Applied Optics, 2013, 34(1): 187-192.
雷霏霖, 刘建伟, 吴玉敬, 等. 机载光电系统中光纤陀螺卡尔曼滤波方法应用[J]. 应用光学, 2013, 34(1): 187-192.
[5]Zhang Guicai, Ba Xiaoyan. The influence of integrated optics device on the performance of fiber-optic gyroscope[J]. Navigation and Control, 2005, 4(1): 45-49.
张桂才, 巴晓艳. 集成光学器件参数对光纤陀螺性能的影响[J]. 导航与控制, 2005, 4(1): 45-49.
[6]Li Xuyou, Wang Changwei, Zou Jibin. The influence of integrated optic device-s stability for fibre optic gyroscopes [J]. Acta Photonica Sinica, 2005, 34(6): 830-834.
李绪友, 王长伟, 邹继斌. 集成光学器件对光纤陀螺稳定性的影响的研究[J]. 光子学报, 2005, 34(6): 830-834.
[7]Wang Minghua, Hao Yanlei, Li Xihua, et al. Fabrication techniques of ion-exchangedglass- based waveguides and related integrated optics components [J]. Infrared and Laser Engineering, 2006, 35（S）: 95-98.
王明华, 郝寅雷, 李锡华,等. 离子交换玻璃光波导工艺与集成光学器件研究[J]. 红外与激光工程, 2006, 35（增刊）: 95-98.
[8] Yin Xiaosu, Xiao Wen. Integrated optic modulator applied in fiber optic gyro [J]. Infrared and Laser Engineering, 2006, 35(3): 285-288.
伊小素, 肖文. 集成光学调制器在光纤陀螺中的调制特性研究[J]. 红外与激光工程, 2006, 35(3): 285-288.
[9] Brown H, Ballman A A, Chin G Y. Knoop microhardness measurements on lithium niobate and lithium tantalate [J]. Journal of Materials Science, 1975, 10(7): 1157-1160.
[10]Xing Tong, Yuan Julong, Zhao Wenhong, et al. Study on the chemo-mechanical polishing quality of LiNbO3 cubic flake [J]. Mechanical Engineer, 2003(7): 19-27.
邢彤, 袁巨龙, 赵文宏,等. 铌酸锂晶片的化学机械抛光质量研究[J]. 机械工程师, 2003(7): 19-27.
[11]Venables M A, Makh S S. Polishing of lithium niobate by ion-beam etching [J]. Journal of Materials Science Letters, 1987, 6: 1254-1256.
[12]Zhang Y L, Yang J D, Feng J L, et al. LiNbO3 rhomboprism machining [J]. SPIE, 1998, 3557: 214-218.
[13]Berggren R R, Schmell R A. Pad polishing for rapid production of large flats [R]. New Mexico: Los Alamos National Laboratory, 1997.
[14]Bifano T G, Dow T A, Scattergood R O. Ductile-regime grinding: a new technology for machining brittle materials[J]. ASME Journal of Engineering for Industry, 1991, 113(2): 184-189.
[15]Inrad. Inrad lithium niobate[EB/OL]. (2002-7-31) [2013-6-25]. http://www.inrad.com/pdf/inrad%20Lithium%20Niobate.pdf.
[16]Luo J F, Dornfeld D A. Material removal mechanism in chemical mechanical polishing: theory and modeling [J]. IEEE Transactions on Semiconductor Manufacturing, 2001, 14(2): 112-133.
[17]Fuu G H, Chandra A, Guha S, et al. A plasticity-based model of material removal in chemical-mechanical polishing (CMP) [J]. IEEE Transactions on Semiconductor Manufacturing, 2001, 14(4): 406-417.

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文章访问数: 1454
HTML全文浏览量: 103
PDF下载量: 167
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LiNbO3芯片的无损边缘抛光实验

通讯作者:
李攀（1983-），男，陕西西安人，工程师，主要从事超光滑表面加工方向的研究。 Email：lp_forever5281@sina.com

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Experiment on defect-free edge polishing of LiNbO3 chips

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LiNbO3芯片的无损边缘抛光实验

通讯作者: 李攀（1983-），男，陕西西安人，工程师，主要从事超光滑表面加工方向的研究。 Email：lp_forever5281@sina.com

计量

出版历程

Experiment on defect-free edge polishing of LiNbO3 chips

计量

出版历程

目录

相关数据库

广告合作

友情链接

帮助中心

通讯作者:
李攀（1983-），男，陕西西安人，工程师，主要从事超光滑表面加工方向的研究。 Email：lp_forever5281@sina.com