[1]张宝安, 陈鹤明, 朱健强.大口径激光玻璃光学加工的质量控制[J].应用光学,2009,30(1):96-100. ZHANG Bao-an, CHEN He-ming, ZHU Jian-qiang.Quality control in large-aperture laser glass optical processing[J].Journal of Applied Optics,2009,30(1):96-100.(in Chinese with an English abstract) [2]WILLSMOREN W J, CARLISLE K, MCKEOWN P A, et al. Ductile regime grinding of glass and other brittle materials by the use of ultra-stiff machine tools [J]. SPIE, 1990, 1333:126-135. [3]BIFANOTG,DOW T A,SCATTERGOOD R O. Ductile-regime grinding: a new technology for machining brittle materials [J]. ASME Journal of Engineering for Industry, 1991, 113(2):184-189. [4]IZUMI KATAOKA. Super smooth polishing technology for aspheric mirrors[J] . JSPE, 1998, 64(7):983-986. [5]SUZUKI HIROFUMI, KODERA SUNAO. Study on precision grinding of micro a spherical surface[J]. JSPE,1988,64(4):619-623. [6]陈明君,张飞虎,董申.光学非球面器件的超精密磨削加工技术研究[J].光学技术,2001,27(6):512-515. CHEN Ming-jun, ZHANG Fei-hu, DONG Shen. Optical aspheric surface of ultra precision grinding machining technology research[J]. Optical Technique, 2001,27(6):512-515.(in Chinese with an English abstract) [7]阎纪旺,于骏一,史国权,等.金刚石车削单晶锗的试验研究[J].中国机械工程,1995,6(6):24-26. YAN Ji-wang, YU Jun-yi, SHI Guo-quan, et al. Experimental research on monocrystal germanium by single point diamond turning technology [J].Chinese Journal of Mechanical Engineering, 1995,6(6):24-26.(in Chinese with an English abstract) [8]陈明君,董申,李旦.单晶硅脆性材料塑性域超精密磨削加工的研究[J].航空精密制造技术,2000,36(2):8-11. CHEN Ming-jun, DONG Shen, LI Dan, et al. Study on ultra-precision grinding of single silicon brittle material in the ductile mode[J]. Aviation Precision Manufacturing Technology, 2000,36(2):8-11. (in Chinese with an English abstract) [9]ARIF M,RAHMAN M,WONG Y S. Ultraprecision ductile mode machining of glass by micromilling process [J].Journal Manufacturing Process,2011,13 (1) : 50-59. [10]ARIF M,RAHMAN M,WONG Y S. Analytical model to determine the critical feed per edge for ductile-brittle transition in milling process of brittle materials[J]. International Journal of Machine Tools and Manufacture,2011,51( 3) : 170-181. [11]CAI M B,LI X P,RAHMAN M, et al. Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon [J]. International Journal of Machine Tools and Manufacture,2007,47: 562-569. [12]BRIAN P O, ERIC R M, JEREMIAH A C. On the effect of crystallographic orientation on ductile material removal in silicon [J] . Precision Engineering, 2005, 29:124-132. [13]ARIF M, RAHMAN M, WONG Y. Analytical modeling of ductile-regime machining of tungsten carbide by endmilling [J]. International Journal Advanced Manufacturing Technology, 2010, 55: 53-64. [14]BLAKE P N,SCATTERGOOD R O. Ductile-regime machining of germanium and silicon [J]. J. Am. Ceram .Soc,1990, 73(4):949-957. [15]史兴宽,滕霖,李雅卿,等. 硬脆材料延性域磨削的临界条件[J].航空精密制造技术,1996,32(4):10-13. SHI Xin-kuan, TENG Lin, LI Ya-qing, et al . Critical condition of ductile grinding for hard brittle materials[J]. Aviation Precision Manufacturing Technology, 1996,32(4):10-13.(in Chinese with an English abstract)
|