[1]LIM S R, KANG D. Potential environmental impacts from the metals in incandescent, compact fluorescent lamp (CFL), and LightEmitting Diode (LED) bulbs [J].Environmental Science & Technology, 2013, 47: 1040-1047. [2]FENG Jin-yuan, DING Jia-lei. Radiator optimization of LED street lamp based on parameterized language APDL ANSYS [J]. Semiconductor Photonics and Technology, 2010, 60:87-91. [3]WANG Yi-wei, ZHANG Jian-xin. Study on high-power LED heat dissipation based on printed circuit board [J]. Semiconductor Photonics and Technology, 2010, 16(2-3):120-124. [4]杨光. 道路照明中大功率LED路灯散热方案的研究[J].照明工程学报, 2010, 21(1):40-47. YANG Guang. Research on schemes about heat dissipation of high-power LED lamp in road lighting[J]. Illuminating Engineering Journal, 2010, 21(1):40-47. (in Chinese with an English abstract). [5]姬文飞.大功率LED灯具散热系统的设计和研究[D].上海: 上海交通大学, 2009. JI Wen-fei. The study and design of LED thermal system[D]. Shanghai: Shanghai Jiao Tong University, 2009. (in Chinese) [6]陈荣利,耿利寅,马臻等.空间相机的热分析与热设计[J]. 光子学报, 2006, 35(1):154-156. CHEN Rong-li, GENG Li-yin, MA Zhen, et al.Thermal analysis and design for high resolution space telescope [J]. Acta Photonica Sinica, 2006, 35(1):154-156. (in Chinese with an English abstract) [7]任红艳, 胡金刚.接触热阻与接触导热填料[J].宇航材料工艺, 1999, 6: 11-25. REN Hong-yan, HU Jin-gang.Thermal contact resistance and thermal conductive filler[J].Aerospace Material & Technology, 1999, 6:11-25. (in Chinese with an English abstract) [8]黄涛, 吴清文, 梁九生,等.空间相机接触热阻的计算[J].中国光学与应用光学,2009, 2(4): 334-339. HUANG Tao, WU Qing-wen, LIANG Jiu-sheng, et al. Calculation of thermal contact resistance for space camera[J]. Chinese Journal of Optics and Applied Optics, 2009, 2(4):334-339. (in Chinese) [9]李菊华.Led灯具热设计与仿真 [D].杭州: 杭州电子科技大学, 2011. LI Ju-hua. Thermal design and simulation of LED lamps[D].Hangzhou: Hangzhou University of Electronic Science and Technology, 2011. (in Chinese) [10]程婷.大功率白光LED照明器件中散热问题的研究[D]. 武汉: 华中科技大学, 2009. CHENG Ting.Investigation on thermal characteristics of high power white LEDs device[D]. Wuhan: Huazhong University of Science and Technology, 2009. (in Chinese) [11]王志斌,张跃宾,王忠东,等.基于热阻网络的大功率LED热管散热研究[J].应用光学,2012,33(6):1014-1018. WANG Zhi-bin, ZHANG Yue-bin, WANG Zhong-dong, et al. Heat pipe heat sink of high power LED based on thermal resistance net work[J]. Journal of Applied Optics, 2012, 33(6): 1014-1018. (in Chinese with an English abstract) [12]杨世铭.传热学[M].北京:高等教育出版社,2006. YANG Shi-ming. Heat transfer [M]. Beijing: Higher Education Press, 2006. (in Chinese) [13]余建祖.电子设备热设计及分析技术[M].北京: 北京航空航天大学出版社, 2008. YU Jian-zu. Electronic equipment thermal design and analysis techniques[M]. Beijing: Beijing University of Aeronautics& Astronautics, 2008. (in Chinese) [14]王乐.白光Led高效封装结构及灯具散热机理的研究[D]. 浙江:浙江大学, 2011. WANG Le. Researches on high efficiency packaging and mechanism of heat dissipation for white LED[D]. Zhejiang: Zhejiang University, 2011. (in Chinese) [15]TIAN Xiao-gai, CHEN Wei, ZHANG Ji-yong. Thermal design for the highpower LED lamp[J]. Journal of Semiconductors, 2011, 32(1): 1-4.
|