连续激光辐照背照式CMOS图像传感器实验研究

Experimental study on back-illuminated CMOS image sensor irradiated by CW laser

  • 摘要: 背照式互补金属氧化物半导体 (complementary metal oxide semiconductor,CMOS)图像传感器较前照式结构显著提高了低光照环境下的拍摄效果,激光对不同结构传感器有不同的干扰损伤机制。为了研究激光对背照式CMOS图像传感器的影响,利用1 064 nm连续激光,开展对背照式CMOS图像传感器的干扰和损伤实验研究。干扰实验观察到饱和与反饱和现象,激光功率密度大于1.39×10−2 W/cm2时出现饱和现象,大于1.03×104 W/cm2时出现反饱和现象。损伤实验观察到点损伤、十字线损伤、面损伤和致盲现象,功率密度大于1.35×106 W/cm2出现点损伤,大于1.74×106 W/cm2出现十字线损伤,大于1.65×107 W/cm2时出现面损伤现象,进一步增加激光功率,探测器最终出现致盲现象。背照式结构电路较前照式结构的位置更深,干扰和损伤所需的激光功率更高,因此抗激光能力更强。

     

    Abstract: Compared to the front-illuminated structure, the back-illuminated complementary metal oxide semiconductor (CMOS) image sensor significantly improves the shooting effect in low light environments, and lasers have different interference and damage mechanisms on different sensor structures. To investigate the impact of lasers on back-illuminated CMOS image sensors, experiments were conducted using a 1 064 nm continuous laser to study the interference and damage. In the interference experiment, saturation and over saturation phenomena were observed. When the laser power density exceeded 1.39×10−2 W/cm2, saturation occurred, and when it exceeded 1.03×104 W/cm2, over saturation occurred. In the damage experiment, spot damage, crossline damage, surface damage, and blindness were observed. When the power density exceeded 1.35×106 W/cm2, spot damage occurred, and when it exceeded 1.74×106 W/cm2, crossline damage occurred. When the power density exceeded 1.65×107 W/cm2, surface damage occurred. If the laser power was further increased, the detector ultimately became blind. The back-illuminated structure circuit is deeper than the front-illuminated structure and requires higher laser power for damage, Therefore, it has stronger laser resistance.

     

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