Abstract: Electron bombarded active pixel sensor (EBAPS) has the advantages of high gain, fast response, low power consumption and low cost. Research on EBAPS has become an important development direction of low-light-level night vision imaging technology. In the circuit design of relevant domestic institutions, the chips involved in the EBAPS imaging circuit mainly rely on imports. In order to accelerate the localization process of imaging circuits of EBAPS devices, a set of domestic-produced imaging circuit evaluation board based on EBAPS was developed. The circuit used the FPGA chip of domestic Fudan Micro FMK50t series as the main control chip, and completed the functions of driving the EBAPS device, digital image processing and real-time display by designing a complementary metal oxide semiconductor (CMOS) driver module, a data processing module, and a Cameralink display module. The experimental results show that when the bombardment negative high voltage is 1 500 V, the minimum detection illuminance of the domestic EBAPS camera can reach the order of 10⁻³ lx.