Abstract: The ultra-thin silver film is a potential material used for transparent conductive electrodes because of its high flexibility and excellent photoelectric properties. The ultra-thin silver transparent conductive films were prepared by resistance thermal evaporation technology using aluminum as infiltration layer. The threshold thickness of the silver film was reduced by introducing an aluminum infiltration layer, so that the silver film could be continuous on the K9 glass substrate at the lowest possible thickness. The resistance of silver film squares on aluminum infiltration layers with different thicknesses was tested, and verified by scanning electron microscope (SEM) images that the 1 nm aluminum infiltration layer had better infiltration effect on silver film. Then, the silver films with different thicknesses were prepared on 1 nm aluminum infiltration layer by the same process. The transmittance and square resistance test results show that the square resistance of 10 nm silver film prepared on 1 nm aluminum infiltration layer can reach 13 Ω/□, and the transmittance can reach more than 50% in the range of 0.4 μm~2.5 μm.