一种微波光子探测器组件的封装设计与实现

Package design and realization of a microwave photon detector component

  • 摘要: 为实现微波光子系统的高集成度、高可靠性,进行了一种微波光子探测器组件的封装设计与实现。介绍了定制化封装设计思路,选择可伐合金作为壳体材料,采用的卧式贴装方案中选用斜面透镜光纤,给出了封装工艺流程和关键工艺点,最终封装的组件光电耦合效率在68%~79%之间,满足总体指标需求。该组件通过混合集成封装方法,实现了微波芯片与光子芯片在同一封装内的阵列化集成及气密性封装。该组件的封装设计与实现方法,可用于其他微波光子产品,有助于提升光载射频传输系统的集成度与可靠性。

     

    Abstract:
    In order to realize the high integration and the high reliability of the microwave photon system, a package design and realization of the microwave photon detector assembly was implemented. The idea of the customized package design was introduced, the kovar alloy was selected as the shell material, the oblique lens fiber was adapted in the horizontal placement scheme, and the package process as well as the key process points were given.
    The photocoupling efficiency of the final package assembly ranges from 68% to 79%, which meets the requirements of the overall index. This detector assembly realizes the array integration and the hermetic package of microwave chip and the photon chip in the same package, by means of the hybrid integrated package method. The package design and the realization method of the assembly can be applied to other microwave photonic products, which contribute to improve the integration and the reliability of radio frequency transmission system.

     

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